Thermal Anneal Temperatures

Principal: dmkelly
Deputy: TBD
Data Monkey(s): The SSC will want to automate this process. From what I have seen, they have plenty of monkeys to choose from.
Priority: Necessary
Downlink Priority: Normal
Analysis Time: 24h
Last Updated:

Objective

Determine the consistency of the heating and cooling curves during thermal anneals to see if there are changes in the thermal conductance paths or in the effectiveness of the heaters.

Description

1) Determine the maximum temperatures of the arrays during each of the
thermal anneals.  
2) Plot maximum temperatures versus time; measure the variance, and look 
for drifts.
3) Generate a master set of temperature curves for each type of anneal.

Data Collected

Diagnostic data will be collected during the thermal anneals.
For the 24um anneal, 160 samples will be collected on 1s intervals.
The items are:
  1. D24TmpA      2. D24TmpB     3. D160TmpA     4. D24AnnealCur  5. D70TmpA
  6. D160JnctTmp  7. D70BaseTmp  8. D160BaseTmp  9. D160StimTmp  10. CSMMTmp
For the 70um anneal, 60 samples will be collected on 1s intervals.
The items are:
  1. D70TmpA      2. D70TmpB     3. D70JnctTmp   4. D70AnHtrCur   5. D24TmpA
  6. D160TmpA     7. D70BaseTmp  8. D160BaseTmp  9. D160JnctTmp  10. CSMMTmp
For the 160um anneal, 80 samples will be collected on 1s intervals.
The items are:
  1. D160TmpA     2. D160TmpB    3. D160JnctTmp  4. D160AnHtrCur  5. D24TmpA
  6. D70TmpA      7. D70BaseTmp  8. D160BaseTmp  9. D160StimTmp  10. CSMMTmp


  ColDiag_160TMP_MIPS
    CEGEANNEAL_Heat_GE160_MIPS
  CEDumpDiag
  ColDiag_70TMP_MIPS
    CEGEANNEAL_Heat_GE70_MIPS
  CEDumpDiag
  ColDiag_24TMP_MIPS
    Si_Anneal_Heat_MIPSA_MIPS
  CEDumpDiag

Data Reformatting Requirements

Array Data Desired:

CECOLDIAG data from the anneals

Data Reformatting Option:

Special Instructions:






Task Dependencies






Calibration Dependencies






Output and Deliverable Products

We will generate plots of temperature versus time for each of the
thermal anneals.  We will record maximum temperatures on each of
the arrays and maintain these results in a database.  Relevant
ancillary data (TBD) will also be entered in the database.  
The data will be tracked as a function of time so that anomalous 
anneals can be identified and so that we can look for drifts in 
anneal behavior.



Data Analysis


Step-by-step analysis:
1) Obtain the diagnostic data.  This seemingly obvious step is called
   out because these data might not be delivered with the usual science data.
   They will not go through tranhead, nor through the SSC pipeline.  
2) Generate plots of temperature versus time for each of the temperatures.
   The dumpdiag tools required for this step are listed below.
3) The diagdump scripts generate an output file listing the maximum 
   temperature reached on each array during an anneal.  These results
   need to be gathered into a database.  Plots should be generated of
   these items versus execution day and time so that long-term trending
   can be performed.
4) Check for changes in the long-term thermal behavior of the arrays 
   during anneals.  If changes are present, assemble ancillary data (TBD) 
   that affects the anneal temperatures and look for trends.  
5) Once a sufficient number of anneal plots has been generated to
   determine nominal behavior, a set of master anneal curves should
   be calculated.  In reaching this stage, the above IDL routines
   should be modified to allow overplotting of several anneal curves.
   Once the master temperature curves are determined, the IDL scripts
   should be modified to automatically overplot the anneal curves and
   the master curves.





Software Requirements







Actions Following Analysis

Check for the long-term stability of the anneal temperatures and
heating and cooling parameters.  If there are drifts, determine 
the cause of the drifts and take action if necessary.  




Failure Modes and Responses

If the temperature behavior during anneals is changing, it indicates
one of two things.  Either the anneal heater is changing in behavior
or the thermal conductance paths are changing.  If the anneal heater
is changing, we need to do some life testing to see if we are at risk
of complete failure.  We will need to adjust the anneal current to
ensure that our anneals continue to be effective, but we need to be
careful not to burn out the anneal heaters in the process.  If the
thermal conductance paths are changing, we will need to do some
thermal modeling to see what is changing.  We will need to develop a
plan for working around the problem.



Additional Notes


The thermal anneal behavior can be compared with the ground data
collected during LBTC, Brutus, and ATLO testing:
annealtemps.summary