Thermal Anneal Temperatures

Principal: dmkelly
Deputy: TBD
Data Monkey(s): The SSC will want to automate this process.
Priority: Necessary
Downlink Priority: Normal
Analysis Time: 24h
Last Updated:

Objective

Determine the consistency of the heating and cooling curves during thermal anneals to see if there are changes in the thermal conductance paths or in the effectiveness of the heaters.

Description

1) Determine the maximum temperatures of the arrays during each of the
thermal anneals.  
2) Perform fits to the temperature curves during warmup and cooldown 
and record fit parameters.  
3) Plot maximum temperatures and fit parameters versus time; measure 
the variance, and look for drifts.

Data Collected

Diagnostic data will be collected during the thermal anneals.
For the 24um anneal, 160 samples will be collected on 1s intervals.
The items are:
  1. D24TmpA      2. D24TmpB     3. D160TmpA     4. D24AnnealCur  5. D70TmpA
  6. D160JnctTmp  7. D70BaseTmp  8. D160BaseTmp  9. D160StimTmp  10. CSMMTmp
For the 70um anneal, 60 samples will be collected on 1s intervals.
The items are:
  1. D70TmpA      2. D70TmpB     3. D70JnctTmp   4. D70AnHtrCur   5. D24TmpA
  6. D160TmpA     7. D70BaseTmp  8. D160BaseTmp  9. D160JnctTmp  10. CSMMTmp
For the 160um anneal, 80 samples will be collected on 1s intervals.
The items are:
  1. D160TmpA     2. D160TmpB    3. D160JnctTmp  4. D160AnHtrCur  5. D24TmpA
  6. D70TmpA      7. D70BaseTmp  8. D160BaseTmp  9. D160StimTmp  10. CSMMTmp


  ColDiag_160TMP_MIPS
    CEGEANNEAL_Heat_GE160_MIPS
  CEDumpDiag
  ColDiag_70TMP_MIPS
    CEGEANNEAL_Heat_GE70_MIPS
  CEDumpDiag
  ColDiag_24TMP_MIPS
    Si_Anneal_Heat_MIPSA_MIPS
  CEDumpDiag

Data Reformatting Requirements

Array Data Desired:

CECOLDIAG data from the anneals -- converted into spreadsheet format

Data Reformatting Option:

Special Instructions:






Task Dependencies






Calibration Dependencies






Output and Deliverable Products

We will generate plots of temperature versus time for each of the
thermal anneals.  We will record maximum temperatures on each of
the arrays and maintain these results in a database.  Relevant
ancillary data (TBD) will also be entered in the database.  We will
also perform fits to the temperature profiles and include fit 
coefficients in the database.  The data will be tracked as a 
function of time so that anomalous anneals can be identified and
so that we can look for drifts in anneal behavior.



Data Analysis


Step-by-step analysis:
1) Obtain the diagnostic data.  This seemingly obvious step is called
   out because these data might not be delivered with the usual science data.
   They will not go through tranhead, nor through the SSC pipeline.  
2) Generate plots of temperature versus time for each of the temperatures.
   If done in Excel, a template file should be generated such that all 
   one has to do is paste in the data and then the plots are generated
   automatically.  One can also develop an IDL or PGPerl script to do this.
3) Determine the maximum temperature reached on each array during its
   anneal and enter these values into a database.  Maintain plots of
   these items versus execution day and time so that long-term trending
   can be performed.
4) Perform fits to the heating and cooling curves and enter the
   fit coefficients into the database.
5) Check for changes in the long-term thermal behavior of the arrays 
   during anneals.  If changes are present, assemble ancillary data (TBD) 
   that affects the anneal temperatures and look for trends.  





Software Requirements







Actions Following Analysis

Check for the long-term stability of the anneal temperatures and
heating and cooling parameters.  If there are drifts, determine 
the cause of the drifts and take action if necessary.  




Failure Modes and Responses

If the temperature behavior during anneals is changing, it indicates
one of two things.  Either the anneal heater is changing in behavior
or the thermal conductance paths are changing.  If the anneal heater
is changing, we need to do some life testing to see if we are at risk
of complete failure.  We will need to adjust the anneal current to
ensure that our anneals continue to be effective, but we need to be
careful not to burn out the anneal heaters in the process.  If the
thermal conductance paths are changing, we will need to do some
thermal modeling to see what is changing.  We will need to develop a
plan for working around the problem.



Additional Notes


Once the diagnostic data analysis tools are developed, there will be
pointers here to those tools.  A table will be added here showing
maximum temperatures reached during thermal anneals in ground testing.