MIPS Campaign Shutdown Activities, Si only

Principal: dmkelly
Deputy: cengelbracht
Data Monkey(s): Can I list Bill Latter as a data monkey?
Priority: Necessary
Downlink Priority: Normal
Analysis Time: 24h
Last Updated:

Objective

Perform a standard set of MIPS tasks before turning off the instrument.

Description

1) Take 10 4s RAW exposures 
2) Perform thermal anneal on the Si array
3) Take 10 4s RAW exposures 
4) Transition from MIPS_OBSERVE to OFF
5) Turn off power to the combined electronics

Data Collected

For the pre-anneal and post-anneal exposures:  mips_raw_C0F2N10
Diagnostic data will be collected during the thermal anneals.
For the 24um anneal, 160 samples will be collected on 1s intervals.
The items are:
  1. D24TmpA      2. D24TmpB     3. D160TmpA     4. D24AnnealCur  5. D70TmpA
  6. D160JnctTmp  7. D70BaseTmp  8. D160BaseTmp  9. D160StimTmp  10. CSMMTmp


# pre-anneal exposure
MIPS_MOBS_PHOT
sendcmd CEGESTIM '"AUTO",63,"BOTHOFF","BOTHOFF","BOTHOFF",10,10,"MIPS"'
sendcmd CEGERSTCON '10,127,4,"MIPS"'
sendcmd CESCANCON '"CHOP","REV",0,2048,2048,0,511,"MIPS"'
# collect 10 4s RAWs
sendcmd CEMIPSRAW  'AORID_upper,AORID_lower,0,"NO_COADD",2,10,"MIPS"'
MIPS_BACKTO_MOBS
# Thermal anneals on Si array
  ColDiag_24TMP_MIPS
    Si_Anneal_Heat_MIPSA_MIPS
  CEDumpDiag
# post-anneal exposure
MIPS_MOBS_PHOT
sendcmd CEGESTIM '"AUTO",63,"BOTHOFF","BOTHOFF","BOTHOFF",10,10,"MIPS"'
sendcmd CEGERSTCON '10,127,4,"MIPS"'
sendcmd CESCANCON '"CHOP","REV",0,2048,2048,0,511,"MIPS"'
# collect 10 4s RAWs
sendcmd CEMIPSRAW  'AORID_upper,AORID_lower,0,"NO_COADD",2,10,"MIPS"'
MIPS_BACKTO_MOBS
# power off the instrument
mips_off
# power off the CE
CE_off

Data Reformatting Requirements

Array Data Desired:

CECOLDIAG data from the anneals All Array data for the pre-anneal and post-anneal exposures

Data Reformatting Option:

Special Instructions:






Task Dependencies






Calibration Dependencies






Output and Deliverable Products

We will generate plots of temperature versus time for the
thermal anneal.  We will record the maximum temperatures 
and maintain these results in a database.  Relevant ancillary 
data (TBD) will also be entered in the database.  We will 
average the 24um data collected after the anneal and divide 
that image by the average of the 3 DCEs collected before the 
anneal.  We will be looking for responsivity changes, changes 
in the ramp offset levels, and for changes in pixel behavior.



Data Analysis


Step-by-step analysis:
1) Obtain the diagnostic data.  This seemingly obvious step is called
   out because these data might not be delivered with the usual science data.
   They will not go through tranhead, nor through the SSC pipeline.  
2) Generate plots of temperature versus time for each of the temperatures.
   The necessary software is presented in the cookbook for mips-015,
   along with the ground-test results.  Notes on planned modifications 
   to this software are presented in the cookbook for mips-900.
3) Determine the maximum temperature reached on each array during its
   anneal and enter these values into a database.  Maintain plots of
   these items versus execution day and time so that long-term trending
   can be performed.
4) Check for changes in the long-term thermal behavior of the arrays 
   during anneals.  If present, assemble ancillary data (TBD) that 
   affects the anneal temperatures and look for trends.  
5) Average the 24um data collected after ther thermal anneal.  Also
   average the 3 DCEs collected before the 24um anneal.  Determine 
   median ramp starting points for these two images.  If there are
   changes, subtract the first frame of one from the other to see
   if the offsets are uniform across the array.
6) Divide the 24um post-anneal image by the pre-anneal image.  Record
   the responsivity change and make notes on changes in pixel behavior.





Software Requirements







Actions Following Analysis

Check for the long-term stability of the anneal temperatures.
If there are drifts, determine the cause of the drifts and take 
action if necessary.  Record the 24um responsivity and offset
level changes that resulted from the thermal anneal and as 
best as possible make an assessment of the effectiveness of the
anneal and of the need for more frequent 24um anneals.




Failure Modes and Responses

There are several possible failures.  If the anneal failed to happen,
we need to determine whether there was a scripting problem and get it
fixed.  We also need to inspect the subsequent data and see if it is
usable.  The data might need to be flagged for special handling, but
probably not since the offset drifts are pretty minimal.  If the heater
failed, we need to assess whether a CE side swap is warranted.  If the
array did not reach the desired temperature, we need to check that
the anneal duration and current were as planned, and we need to assess
whether thermal conductances have changed since ground testing.  If the
CECOLDIAG data are corrupted, we need to determine first and foremost
whether the anneal happened, and then we can check for scripting errors.



Additional Notes